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ADT7462ACPZ-REEL - onsemi

Description: One Local and up to Three Remote Temperature Channels, Series Resistance Cancellation on Remote Channels; Thermal Protection Using THERM Pins; Up to Four PWM Fan Drive Outputs, Supports Both High and Low Frequency PWM Drives; Up to Eight TACH Inputs Measures the Speed of 3-wire and 4-wire Fans; Automatic Fan Speed Control Loop Includes Dynamic TMIN Control; Monitors up to 13 Voltage Inputs; Monitors up to 7 VID Inputs Includes VID-on-fly Support; Bidirectional Reset; Chassis Intrusion Detect; SMBus 1.1- and

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ADT7462ACPZ-REEL - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - ADT7462ACPZ-REEL
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ADT7462ACPZ-REEL Details

  • Manufacturer Part Number:

    ADT7462ACPZ-REEL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    LFCSP32, 5x5, 0.5P

  • Package Description:

    LFCSP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    932AE

  • Country Of Origin:

    Philippines

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Accuracy-Max (Cel):

    4 Cel

  • Additional Feature:

    HYSTERESIS IS 0.07V

  • Body Breadth:

    5 mm

  • Body Height:

    0.9 mm

  • Body Length or Diameter:

    5 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    8

  • Number of Terminals:

    32

  • Operating Current-Max:

    4 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    4-WIRE INTERFACE

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

ADT7462ACPZ-REEL Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Calibrate the device using the CAL pin, and ensure that the thermal sensor is in close proximity to the device being monitored. Also, minimize thermal gradients and ensure good thermal coupling between the device and the thermal sensor.
  • The maximum allowed thermal resistance is 10°C/W. Exceeding this value may result in inaccurate temperature measurements.
  • Yes, but ensure that the thermal sensor is within 10 inches (25 cm) of the device and that the thermal resistance between the device and the sensor is minimized.
  • Use a soft-start circuit to limit the inrush current during power-up, and ensure that the device is powered down slowly to prevent thermal shutdown.

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ADT7462ACPZ-REEL Overview

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