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ADUM341E1BRWZ - Analog Devices

Description: 5.7 kV/3.0 kV rms Quad Digital Isolators

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ADUM341E1BRWZ - Analog Devices - PCB symbol
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ADUM341E1BRWZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 300 MIL_2023-3
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3D Models
ADUM341E1BRWZ - Analog Devices - 3D model - Small Outline Packages - SOIC 300 MIL_2023-3
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ADUM341E1BRWZ Details

  • Manufacturer Part Number:

    ADUM341E1BRWZ

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 300 MIL

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOIC 300 MIL

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

ADUM341E1BRWZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADUM341E1BRWZ should minimize the distance between the input and output pins, use a solid ground plane, and avoid running high-frequency signals near the isolation barrier. Additionally, it's recommended to use a symmetrical layout to reduce electromagnetic interference (EMI).
  • To ensure reliable operation of the ADUM341E1BRWZ in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding excessive power dissipation. Additionally, the device should be operated within its specified temperature range (-40°C to 125°C).
  • The ADUM341E1BRWZ can operate with a high common-mode voltage (up to 1 kV peak) without compromising its isolation performance. However, it's essential to ensure that the common-mode voltage does not exceed the maximum rating, as this can lead to reduced isolation performance or even device failure.
  • To troubleshoot issues with the ADUM341E1BRWZ, start by verifying the power supply voltages, checking for proper connections and PCB layout, and ensuring that the device is operated within its specified temperature range. Additionally, use a logic analyzer or oscilloscope to monitor the input and output signals, and consult the datasheet and application notes for guidance on troubleshooting common issues.
  • The ADUM341E1BRWZ is designed to operate with a 5 V supply voltage, but it can also be used with a 3.3 V supply voltage with some limitations. Consult the datasheet and application notes for guidance on using the device with different supply voltages, and ensure that the device is operated within its specified voltage range.

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ADUM341E1BRWZ Overview

Use the download button to access the ADUM341E1BRWZ schematic symbol, PCB footprint, and 3D model.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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