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ADV3003ACPZ - Analog Devices

Description: ADV3003ACPZ, Video Buffer 2.25Gbit/s DVI, HDMI 1600 x 1200pixel 3 → 3.6 V 40-Pin LFCSP

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PCB Footprints
ADV3003ACPZ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 40-Lead Lead Frame Chip Scale Package [LFCSP] 6 mm × 6 mm Body and 0.75 mm Package Height (CP-40-10)
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3D Models
ADV3003ACPZ - Analog Devices  - 3D model - Quad Flat No-Lead - 40-Lead Lead Frame Chip Scale Package [LFCSP] 6 mm × 6 mm Body and 0.75 mm Package Height (CP-40-10)
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ADV3003ACPZ Details

  • Manufacturer Part Number:

    ADV3003ACPZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    LFCSP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    CP-40-10

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

ADV3003ACPZ Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the analog power supplies (AVCC and DVCC). This ensures proper device operation and prevents latch-up.
  • To optimize performance, use a low-ESR capacitor (e.g., 0.1 μF) between VCC and GND, and a 10 μF capacitor between AVCC and AGND. Additionally, use a low-inductance path for the power supply lines and minimize the distance between the device and the decoupling capacitors.
  • The ADV3003ACPZ supports clock frequencies up to 1.2 GHz. However, the maximum clock frequency may vary depending on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • To ensure proper thermal management, use a heat sink or thermal pad on the exposed pad of the package. Additionally, ensure good airflow around the device and avoid blocking the airflow with other components or obstacles.
  • The recommended layout and routing for the ADV3003ACPZ involves using a symmetrical layout, minimizing the distance between the device and the decoupling capacitors, and using a solid ground plane to reduce noise and improve signal integrity.

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ADV3003ACPZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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