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ADV3222ARZ - Analog Devices

Description: Analog Devices ADV3222ARZ, Multiplexer Single 4 x 1, 16-Pin SOIC

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PCB Footprints
ADV3222ARZ - Analog Devices PCB footprint - Other - Other - SOIC127P600X175-16N
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ADV3222ARZ - Analog Devices  - 3D model - Other - SOIC127P600X175-16N
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ADV3222ARZ Details

  • Manufacturer Part Number:

    ADV3222ARZ

  • Source Url Status Check Date:

    2013-05-01 14:56:51.536

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AC, SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    R-16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Signal Current-Max:

    0.009 A

  • Supply Current-Max (Isup):

    9 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ADV3222ARZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the ADV3222ARZ is to use a 4-layer board with a solid ground plane, and to keep the analog and digital signals separate. The device's exposed pad should be connected to a solid ground plane to ensure good thermal performance and noise reduction.
  • To ensure the ADV3222ARZ is properly powered, use a low noise, low dropout voltage regulator (LDO) to power the device. The power supply should be decoupled with a 10uF capacitor in parallel with a 0.1uF capacitor, and the power pins should be connected to a clean, low-impedance power plane.
  • The ADV3222ARZ can support clock frequencies up to 170 MHz, but the maximum clock frequency may vary depending on the specific application and the quality of the clock signal. It's recommended to consult the datasheet and application notes for more information.
  • The ADV3222ARZ can be configured for a specific video format using the device's registers. The registers can be programmed using a serial interface, such as I2C or SPI, and the specific configuration will depend on the video format and application requirements. Consult the datasheet and application notes for more information.
  • The typical power consumption of the ADV3222ARZ is around 350mW, but this can vary depending on the specific application, clock frequency, and video format. Consult the datasheet and application notes for more information on power consumption and power management.

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ADV3222ARZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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