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ADV7802BSTZ-80 - Analog Devices

Description: ADV7802BSTZ-80, Video Decoder CVBS, NTSC, PAL, SECAM, S-Video 4-channel 12bit- 1.8 (Digital) V, 3.3 (Analogue) V 176-Pin

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ADV7802BSTZ-80 - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - ST-176 (LQFP)
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ADV7802BSTZ-80 - Analog Devices  - 3D model - Quad Flat Packages - ST-176 (LQFP)
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ADV7802BSTZ-80 Details

  • Manufacturer Part Number:

    ADV7802BSTZ-80

  • Source Url Status Check Date:

    2013-05-01 14:56:51.984

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    26 X 26 MM, ROHS COMPLIANT, MS-026BGA, LQFP-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    ST-176

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    IT ALSO OPERATES AT 1.8V DIGITAL SUPPLY

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G176

  • Length:

    24 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    24 mm

ADV7802BSTZ-80 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the ADV7802BSTZ-80 can be found in the 'Layout Considerations' section of the datasheet. Additionally, Analog Devices provides a reference design and layout guidelines in the 'ADV7802 Evaluation Board User Guide' document.
  • The ADV7802BSTZ-80 can be configured for specific video formats using the I2C interface. The 'ADV7802 Register Map' document provides a detailed description of the registers and their settings for different video formats. Additionally, the 'ADV7802 Software Development Kit' provides a software library and examples to configure the device.
  • The maximum cable length supported by the ADV7802BSTZ-80 depends on the video format and the quality of the cable. As a general guideline, the device can support cable lengths up to 10 meters for HDMI 2.0 and up to 15 meters for HDMI 1.4. However, it's recommended to consult the 'HDMI Specification' and perform signal integrity analysis to determine the maximum cable length for a specific application.
  • Analog Devices provides a 'Troubleshooting Guide' document that covers common issues and their solutions. Additionally, the 'ADV7802 Evaluation Board User Guide' provides a section on troubleshooting and debugging. Engineers can also contact Analog Devices' technical support for further assistance.
  • The ADV7802BSTZ-80 is a HDMI 2.0 device and does not support HDMI 2.1. However, Analog Devices offers other devices that support HDMI 2.1, such as the ADV7842. Engineers should consult the datasheet and product page of the specific device to determine its HDMI version support.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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