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ADW54010Z-0REEL - Analog Devices

Description: Analogue Switch ICs LOW VOLTAGE DUAL SPDT I.C.

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ADW54010Z-0REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 0-Lead Mini Small Outline Package [MSOP] (RM-10)
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ADW54010Z-0REEL - Analog Devices  - 3D model - Small Outline Packages - 0-Lead Mini Small Outline Package [MSOP] (RM-10)
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ADW54010Z-0REEL Details

  • Manufacturer Part Number:

    ADW54010Z-0REEL

  • Source Url Status Check Date:

    2013-05-01 14:56:52.073

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    62 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    12 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    10 ns

  • Switch-on Time-Max:

    20 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ADW54010Z-0REEL Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. A thermal pad on the bottom of the device should be connected to a solid ground plane or a thermal relief pattern.
  • Use a low-ESR capacitor (e.g., 10uF) as close as possible to the device's power pins. Add a 1uF capacitor in parallel for high-frequency decoupling. Ensure the power supply has a low ripple and noise floor (<10mV).
  • Use a single, low-jitter clock source (e.g., a crystal oscillator) and distribute it to all devices. Ensure clock signals are buffered and terminated properly to minimize skew and jitter.
  • Implement 8b/10b encoding and decoding for data transmission. Use a reliable clock recovery mechanism, such as a phase-locked loop (PLL) or a clock data recovery (CDR) circuit. Ensure proper signal termination and impedance matching.
  • Use a high-speed oscilloscope (e.g., 10GHz) with a low-capacitance probe to minimize signal degradation. Perform eye diagram analysis and measure signal integrity parameters (e.g., jitter, rise time, and amplitude).

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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