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ADXRS649BBGZ-RL - Analog Devices

Description: MEMS Single Axis ±20000°/s 32-Pin CBGA T/R

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ADXRS649BBGZ-RL - Analog Devices PCB footprint - BGA - BGA - BG-32-3
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ADXRS649BBGZ-RL - Analog Devices  - 3D model - BGA - BG-32-3
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ADXRS649BBGZ-RL Details

  • Manufacturer Part Number:

    ADXRS649BBGZ-RL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    BG-32-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    7A994

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-CBGA-B32

  • JESD-609 Code:

    e3

  • Length:

    6.85 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA32,7X7,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.8 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.85 mm

ADXRS649BBGZ-RL Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout and land pattern in the ADXRS649BBGZ-RL evaluation board documentation, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance and minimize noise.
  • Calibration involves adjusting the zero-rate offset and sensitivity scale factor. Analog Devices provides a calibration procedure in the ADXRS649BBGZ-RL datasheet, which involves applying a known rotation rate and measuring the output. The calibration process can be done using the ADIS16209 evaluation board or a custom calibration setup.
  • The recommended power-up sequence is to apply VDD (3.3V) first, followed by VIO (1.8V). This ensures that the internal voltage regulators are powered up correctly. It's also essential to ensure that the power supplies are stable and well-regulated to prevent noise and errors.
  • The HPF and LPF settings can be adjusted using the FILT_SEL pin. The HPF helps remove bias and offset errors, while the LPF reduces noise and high-frequency components. The optimal filter settings depend on the specific application and noise environment. Analog Devices provides guidance on filter selection in the ADXRS649BBGZ-RL datasheet.
  • The ADXRS649BBGZ-RL is rated for operation from -40°C to +125°C. However, the device's performance and accuracy may degrade at extreme temperatures. It's essential to ensure proper thermal management and consider temperature compensation in the system design.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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