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AFE5809ZCF - Texas Instruments

Description: Fully-Integrated, 8-Ch Ultrasound Analog Front End w/ Passive CW Mixer and Digital I/Q Demodulation

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Symbol
AFE5809ZCF - Texas Instruments - PCB symbol
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PCB Footprints
AFE5809ZCF - Texas Instruments PCB footprint - BGA - BGA - ZCF (R-PBGA-N135)
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3D Models
AFE5809ZCF - Texas Instruments - 3D model - BGA - ZCF (R-PBGA-N135)
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AFE5809ZCF Details

  • Manufacturer Part Number:

    AFE5809ZCF

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO REQUIRES 5V AND 1.8 V SUPPLY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PBGA-B135

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    135

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

AFE5809ZCF Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the AFE5809ZCF evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The AFE5809ZCF has a programmable AFE, and the optimal settings depend on the specific application and sensor used. TI provides a software development kit (SDK) and application notes that provide guidance on optimizing the AFE settings for various applications.
  • The AFE5809ZCF's SPI interface can operate at a maximum data transfer rate of 20 Mbps, but the actual data transfer rate may be limited by the specific application and system design.
  • TI provides guidelines for EMC and EMI compliance in the AFE5809ZCF datasheet and application notes, including recommendations for PCB layout, shielding, and filtering to minimize electromagnetic emissions and susceptibility.
  • The AFE5809ZCF's power consumption varies depending on the operating mode and settings. TI provides power consumption estimates in the datasheet, and application notes provide guidance on optimizing power consumption for low-power applications, including techniques such as dynamic voltage and frequency scaling.

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AFE5809ZCF Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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