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AFE5851IRGCR - Texas Instruments

Description: ADC

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PCB Footprints
AFE5851IRGCR - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
AFE5851IRGCR - Texas Instruments  - 3D model - Other - QFN50P900X900X100-65N
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AFE5851IRGCR Details

  • Manufacturer Part Number:

    AFE5851IRGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES ON 3V SUPPLY

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

AFE5851IRGCR Frequently Asked Questions (FAQs)

  • TI provides a recommended PCB layout in the AFE5851IRGCR evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and EMI. It's essential to follow these guidelines to ensure optimal performance.
  • The AFE5851IRGCR's ADC can be optimized by adjusting the sampling rate, gain, and offset settings. TI provides an ADC optimization guide in the device's user guide, which includes equations and examples to help engineers tailor the ADC to their specific application requirements.
  • The AFE5851IRGCR's SPI interface can operate at a maximum data transfer rate of 50 Mbps. However, the actual data transfer rate may be limited by the system's clock speed, bus loading, and other factors.
  • The AFE5851IRGCR has several power-down modes that can be controlled through the device's registers. TI provides a detailed description of the power-down modes and their implementation in the device's user guide. Engineers can use these modes to reduce power consumption during idle periods or when the device is not in use.
  • The AFE5851IRGCR can use an external clock source or its internal oscillator. TI recommends using a high-quality external clock source, such as a crystal oscillator, to ensure clock stability and accuracy. Engineers should also follow proper PCB design and layout practices to minimize clock signal degradation and noise.

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AFE5851IRGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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