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- Part Number AG302-63G
- Manufacturer Qorvo
- Pin Count 6
- Part Category Integrated Circuit
- Package Category SOT23 (6-Pin)
- Footprint Name SOT23 (6-Pin) - AG302-63G
- Released Date Apr 19, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
AG302-63G Details
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Manufacturer Part Number:
AG302-63G
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
GREEN, PLASTIC, MO-203, SOT-363, SMT, 6 PIN
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ECCN Code:
5A991.B
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Manufacturer:
Qorvo
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YTEOL:
3
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Additional Feature:
HIGH RELIABILITY
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Characteristic Impedance:
50 Ω
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Construction:
COMPONENT
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Gain:
13.5 dB
AG302-63G Frequently Asked Questions (FAQs)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use a thermal pad or heat sink for high-power applications.
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Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a 50-ohm system impedance and adjusting the component values for optimal gain and efficiency.
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Operate the device within the recommended temperature range (-40°C to 85°C) and avoid exceeding the maximum junction temperature (150°C). Ensure proper voltage and current derating for high-reliability applications.
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Use proper shielding, grounding, and filtering techniques to minimize EMI. Ensure the device is placed in a shielded enclosure and follow proper PCB layout practices to reduce radiation.
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Use a vector network analyzer (VNA) or a scalar network analyzer to characterize the device's S-parameters. Perform load-pull characterization to optimize the output matching network.
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AG302-63G Overview
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About Qorvo
Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.