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AGL125V5-CSG196I - Microchip

Description: FPGA - Field Programmable Gate Array AGL125V5-CSG196I

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AGL125V5-CSG196I - Microchip PCB footprint - BGA - BGA - CS196
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AGL125V5-CSG196I - Microchip  - 3D model - BGA - CS196
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AGL125V5-CSG196I Details

  • Manufacturer Part Number:

    AGL125V5-CSG196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSP-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    TFBGA-196

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Clock Frequency-Max:

    108 MHz

  • JESD-30 Code:

    S-PBGA-B196

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    125000

  • Number of Inputs:

    133

  • Number of Logic Cells:

    3072

  • Number of Outputs:

    133

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3072CLBS, 125000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA196,14X14,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.575 V

  • Supply Voltage-Min:

    1.425 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 130 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

AGL125V5-CSG196I Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Microchip's guidelines for PCB layout and thermal management. This includes using a 4-layer PCB with a solid ground plane, placing decoupling capacitors close to the device, and using thermal vias to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • To implement power sequencing and voltage regulation, use a power management IC (PMIC) that can provide the required voltage rails. Ensure the PMIC can handle the device's power requirements and follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, consider using a voltage supervisor to monitor and reset the device in case of voltage faults.
  • For optimal clocking and timing performance, follow the recommended clocking schemes and configuration guidelines outlined in the datasheet. Ensure the clock sources are stable and within the specified frequency range. Additionally, consider using the device's built-in clock monitoring and correction features to ensure reliable operation.
  • To troubleshoot and debug issues, use a combination of tools such as logic analyzers, oscilloscopes, and debug software. Start by verifying the device's power and clocking configurations, then use the device's built-in debug features, such as the debug interface and event triggers, to identify and isolate issues. Consult the datasheet and application notes for specific guidance on debugging and troubleshooting.
  • To ensure EMC and EMI compliance, follow the recommended PCB layout and design guidelines outlined in the datasheet. Use shielding, filtering, and grounding techniques to minimize emissions and susceptibility. Additionally, consider using EMI filters and common-mode chokes to reduce emissions and improve immunity.

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AGL125V5-CSG196I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image AGL125V5-CS196I Microsemi Corporation (now Microchip)

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