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AGLN020V2-CSG81 - Microchip

Description: IGLOO nano Field Programmable Gate Array (FPGA) IC 52 520 81-WFBGA, CSBGA

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AGLN020V2-CSG81 - Microchip PCB footprint - BGA - BGA - CS81
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AGLN020V2-CSG81 - Microchip  - 3D model - BGA - CS81
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AGLN020V2-CSG81 Details

  • Manufacturer Part Number:

    AGLN020V2-CSG81

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81

  • Pin Count:

    81

  • Manufacturer Package Code:

    VFBGA-81

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • JESD-30 Code:

    S-PBGA-B81

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    520

  • Number of Equivalent Gates:

    20000

  • Number of Terminals:

    81

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Organization:

    520 CLBS, 20000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA81,9X9,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    1.575 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 130 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

AGLN020V2-CSG81 Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout and thermal management guide in their application note AN2005. It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused peripherals, and use the power-saving features such as sleep mode and dynamic voltage scaling. Refer to the datasheet and application notes for specific guidance.
  • To ensure EMI and EMC compliance, follow proper PCB design and layout practices, use shielding and filtering, and implement EMI-reducing techniques such as spread spectrum clocking. Microchip provides guidance on EMI and EMC considerations in their application note AN2006.
  • Use Microchip's MPLAB X IDE and the built-in debugger to troubleshoot and debug issues. Also, refer to the datasheet, application notes, and Microchip's technical support resources for guidance on common issues and error messages.
  • Carefully review the datasheet and application notes to understand the limitations and constraints of each peripheral and interface, such as clock frequency limitations, data transfer rates, and buffer sizes. This will help ensure proper usage and avoid potential issues.

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AGLN020V2-CSG81 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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