AGMF039R47A1E1V - Intel

AGMF039R47A1E1V Details

• Manufacturer Part Number:

  AGMF039R47A1E1V

• Part Life Cycle Code:

  Transferred

• Package Description:

  BGA-4700

• HTS Code:

  8542.31.00.60

• Manufacturer:

  Intel Corporation

• YTEOL:

  7

• Additional Feature:

  TERM PITCH-MIN

• JESD-30 Code:

  R-PBGA-B4700

• Length:

  66 mm

• Number of CLBs:

  130560

• Number of Inputs:

  768

• Number of Logic Cells:

  3851520

• Number of Outputs:

  768

• Number of Terminals:

  4700

• Operating Temperature-Max:

  100 °C

• Organization:

  130560 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Programmable Logic Type:

  FPGA SOC

• Seated Height-Max:

  5.029 mm

• Supply Voltage-Max:

  0.721 V

• Supply Voltage-Min:

  0.679 V

• Supply Voltage-Nom:

  0.7 V

• Surface Mount:

  YES

• Terminal Form:

  BALL

• Terminal Pitch:

  0.92 mm

• Terminal Position:

  BOTTOM

• Width:

  56 mm