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AGN20024 - Panasonic

Description: Telecom Relay DPDT (2 Form C) Through Hole

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AGN20024 - Panasonic PCB footprint - Other - Other - AGN200x
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AGN20024 - Panasonic  - 3D model - Other - AGN200x
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AGN20024 Details

  • Manufacturer Part Number:

    AGN20024

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7.75

  • Additional Feature:

    RELEASE TIME WITH DIODE

  • Body Breadth:

    5.7 mm

  • Body Height:

    9 mm

  • Body Length or Diameter:

    10.6 mm

  • Coil Current(DC)-Max:

    0.01 A

  • Coil Operate Voltage(DC):

    18 V

  • Coil Power:

    230 mW

  • Coil Release Voltage(DC):

    2.4 V

  • Coil Resistance:

    2504 Ω

  • Coil Voltage(DC)-Max:

    24 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Rating R Load:

    1A@125VAC

  • Contact Current(AC)-Max:

    1 A

  • Contact Current(DC)-Max:

    1 A

  • Contact (DC) Max Rating R Load:

    1A@110VDC

  • Contact Voltage(AC)-Max:

    125 V

  • Contact Voltage(DC)-Max:

    110 V

  • Contact/Output Supply Type:

    AC/DC

  • Electrical Life:

    100000 Cycle(s)

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Operate Time:

    4 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BOX; TUBE

  • Physical Dimension:

    10.6mm x 5.7mm x 9mm

  • Reference Standard:

    BSI; CSA; UL

  • Relay Action:

    MOMENTARY

  • Relay Function:

    DPDT

  • Relay Type:

    POWER/SIGNAL RELAY

  • Release Time:

    4 ms

  • Sealing:

    WATER PROOF

  • Surface Mount:

    NO

  • Termination Type:

    SOLDER

AGN20024 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and symmetrical, and use a common mode choke to reduce EMI.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Use thermal management techniques, such as heat sinks or thermal interfaces, to keep the junction temperature below 150°C.
  • Use a common mode choke and a differential mode filter to reduce EMI. Place the filter components close to the AGN20024 and use a shielded enclosure to minimize radiation.
  • Use a low-dropout linear regulator or a switching regulator with a high efficiency to minimize power loss. Optimize the PCB layout to reduce parasitic resistances and inductances, and consider using a power-saving mode or shutdown feature.
  • The AGN20024 is designed to meet the reliability and durability requirements of automotive and industrial applications. It has a high MTBF (mean time between failures) and is qualified to meet various industry standards, such as AEC-Q100 and IEC 60747.

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AGN20024 Overview

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