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AGN200S03 - Panasonic

Description: High sensitivity, 100 mW operating power, 2 Form C, 1 A, compact size and slim relays

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PCB Footprints
AGN200S03 - Panasonic PCB footprint - Other - Other - GN_S
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AGN200S03 - Panasonic  - 3D model - Other - GN_S
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AGN200S03 Details

  • Manufacturer Part Number:

    AGN200S03

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7.5

  • Additional Feature:

    RELEASE TIME WITH DIODE

  • Body Breadth:

    5.7 mm

  • Body Height:

    9 mm

  • Body Length or Diameter:

    10.6 mm

  • Coil Current(DC)-Max:

    0.047 A

  • Coil Operate Voltage(DC):

    2.25 V

  • Coil Power:

    140 mW

  • Coil Release Voltage(DC):

    0.3 V

  • Coil Resistance:

    64.2 Ω

  • Coil Voltage(DC)-Max:

    3 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Rating R Load:

    1A@125VAC

  • Contact Current(AC)-Max:

    1 A

  • Contact Current(DC)-Max:

    1 A

  • Contact (DC) Max Rating R Load:

    1A@110VDC

  • Contact Voltage(AC)-Max:

    125 V

  • Contact Voltage(DC)-Max:

    110 V

  • Contact/Output Supply Type:

    AC/DC

  • Electrical Life:

    100000 Cycle(s)

  • Mounting Feature:

    SURFACE MOUNT-STRAIGHT

  • Operate Time:

    4 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BOX; TAPE AND REEL

  • Physical Dimension:

    10.6mm x 5.7mm x 9mm

  • Reference Standard:

    BSI; CSA; UL

  • Relay Action:

    MOMENTARY

  • Relay Function:

    DPDT

  • Relay Type:

    POWER/SIGNAL RELAY

  • Release Time:

    4 ms

  • Sealing:

    WATER PROOF

  • Surface Mount:

    NO

  • Termination Type:

    SOLDER

AGN200S03 Frequently Asked Questions (FAQs)

  • The recommended storage condition for AGN200S03 is in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing in direct sunlight or near heat sources.
  • While the AGN200S03 is designed to be robust, it's not recommended for use in high-vibration environments (e.g., >10G) without proper mounting and mechanical support. Consult Panasonic's application notes for guidance on vibration testing and mitigation.
  • Follow standard reflow soldering procedures, ensuring the component is within the recommended temperature range (220°C to 240°C). Avoid exposing the device to excessive heat, moisture, or mechanical stress during the soldering process.
  • The maximum allowable current for the AGN200S03 is 200mA. Exceeding this current may lead to device degradation or failure. Ensure your design stays within the recommended operating current range.
  • The AGN200S03 is not designed for use in humid or wet environments. If your application requires operation in such conditions, consider using a conformal coating or potting compound to protect the device. Consult Panasonic's application notes for guidance on environmental protection.

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AGN200S03 Overview

Use the download button to access the AGN200S03 schematic symbol, PCB footprint, and 3D model.
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