AIML-0805-180K-T footprint, schematic symbol and 3D model by ABRACON

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AIML-0805-180K-T Details

The recommended land pattern for the AIML-0805-180K-T is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
The AIML-0805-180K-T is rated for operation up to 125°C, but it's recommended to derate the component's power handling at higher temperatures. Consult the datasheet and Abracon's application notes for specific guidance on high-temperature use.
The AIML-0805-180K-T is a moisture-sensitive device. To prevent damage, store the components in a dry environment (less than 30% RH) and follow Abracon's recommended handling and storage procedures. Baking the components before reflow soldering may also be necessary.
Abracon recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. However, the specific profile may vary depending on the board design and manufacturing process.
The AIML-0805-180K-T is designed to withstand moderate vibration levels. However, extreme vibration may affect the component's performance and reliability. Consult Abracon's application notes and perform thorough testing to ensure the component meets the specific requirements of your application.

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