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AIML-0805-1R0K-T - ABRACON

Description: IND 27nH 0.3A 450m¢„¦

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AIML-0805-1R0K-T - ABRACON PCB footprint - Inductors Chip - Inductors Chip - AIML-0805-1R2K-T
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AIML-0805-1R0K-T - ABRACON  - 3D model - Inductors Chip - AIML-0805-1R2K-T
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AIML-0805-1R0K-T Details

  • Manufacturer Part Number:

    AIML-0805-1R0K-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.4 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.05 A

  • Self Resonance Frequency:

    95 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT 30% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

AIML-0805-1R0K-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the AIML-0805-1R0K-T is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • The AIML-0805-1R0K-T is rated for operation up to 125°C, but it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the PCB material and soldering process should be suitable for high-temperature applications.
  • During reflow soldering, ensure that the component is exposed to a maximum temperature of 260°C for no more than 10 seconds. It's also crucial to follow the recommended reflow profile and ensure that the component is properly centered on the PCB to prevent thermal shock.
  • Yes, the AIML-0805-1R0K-T is compatible with lead-free soldering processes. However, it's essential to follow the recommended soldering profile and ensure that the soldering process is optimized for lead-free soldering.
  • The AIML-0805-1R0K-T should be stored in a dry, cool place with a temperature range of 10°C to 30°C and a relative humidity of 50% to 70%. It's essential to avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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AIML-0805-1R0K-T Overview

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