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AIML-1206-1R8K-T - ABRACON

Description: IND 1.8uH 0.05A 500m¢„¦

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AIML-1206-1R8K-T - ABRACON - PCB symbol
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PCB Footprints
AIML-1206-1R8K-T - ABRACON PCB footprint - Inductors Chip - Inductors Chip - AIML-1206
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AIML-1206-1R8K-T - ABRACON - 3D model - Inductors Chip - AIML-1206
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AIML-1206-1R8K-T Details

  • Manufacturer Part Number:

    AIML-1206-1R8K-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    1206

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.5 Ω

  • Inductance-Nom (L):

    1.8 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.1 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.05 A

  • Self Resonance Frequency:

    66 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    10%

AIML-1206-1R8K-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
  • While the AIML-1206-1R8K-T is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments.
  • To prevent moisture-related issues, follow proper storage and handling procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering.
  • Abracon recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second to ensure reliable soldering and minimize thermal stress.
  • While the AIML-1206-1R8K-T is designed to be robust, it's crucial to consider the vibration specifications and ensure that the component is properly secured to the PCB to prevent mechanical stress and damage.

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AIML-1206-1R8K-T Overview

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