AIRD-06-100K footprint, schematic symbol and 3D model by ABRACON

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AIRD-06-100K Details

Abracon recommends a land pattern with a minimum pad size of 1.3mm x 1.3mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and to prevent solder bridging.
To prevent damage, Abracon recommends following a reflow soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds above 220°C (428°F).
Yes, the AIRD-06-100K is compatible with lead-free soldering processes and is RoHS compliant.
The AIRD-06-100K is designed to operate over a temperature range of -40°C to +125°C (-40°F to +257°F).
Abracon recommends storing the AIRD-06-100K in a dry, cool place with a relative humidity of 50% or less, and in its original packaging or a sealed bag with desiccant.

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