AISM-1812-1R0K-T footprint, schematic symbol and 3D model by ABRACON

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AISM-1812-1R0K-T Details

Abracon recommends a land pattern with a pad size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad and a minimum clearance of 0.2mm from the pad to the solder mask.
Yes, AISM-1812-1R0K-T is rated for operation up to 125°C, but it's recommended to derate the component's power handling according to the temperature derating curve provided in the datasheet.
AISM-1812-1R0K-T is a moisture-sensitive device (MSD) and should be stored in a dry environment with a relative humidity below 30%. If the component is exposed to moisture, it's recommended to bake it according to the manufacturer's recommended baking schedule before reflow soldering.
Abracon recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second maximum.
Yes, AISM-1812-1R0K-T is designed for high-frequency operation up to 1.8 GHz, but it's recommended to evaluate the component's performance in the specific application and consider factors such as parasitic inductance and capacitance.

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