AIUR-10-471K footprint, schematic symbol and 3D model by ABRACON

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AIUR-10-471K Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape, and a minimum clearance of 0.2mm between the pad and the solder mask.
To prevent moisture-related issues, Abracon recommends storing the AIUR-10-471K in a dry environment (less than 30% relative humidity) and baking the components at 125°C for 24 hours before reflow soldering.
The maximum reflow temperature for the AIUR-10-471K is 260°C, with a maximum time of 30 seconds above 240°C.
While the AIUR-10-471K is designed to be robust, Abracon recommends evaluating the component's performance in high-vibration environments through additional testing and analysis, as the component's resonant frequency may be affected.
To troubleshoot frequency stability issues, Abracon recommends checking the component's power supply, ensuring proper PCB layout and grounding, and verifying that the component is operated within its specified temperature range.

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