SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.1 mm
Supply Voltage-Max:
60 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
3 mm
AL5817MP-13 Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure the device is properly biased, make sure to follow the recommended operating conditions in the datasheet, including the input voltage range, output voltage range, and output current. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device.
The maximum junction temperature that the AL5817MP-13 can withstand is 150°C. However, it's recommended to keep the junction temperature below 125°C for optimal reliability and performance.
Yes, the AL5817MP-13 is qualified to AEC-Q100 Grade 1, making it suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure the device meets the required reliability and performance standards.
To troubleshoot issues with the device, start by verifying the input voltage, output voltage, and output current are within the recommended operating conditions. Check the PCB layout for thermal issues, and ensure that the input and output capacitors are properly selected and placed. If the issue persists, consult the datasheet and application notes for guidance, or contact Diodes Incorporated's technical support team.
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AL5817MP-13 Overview
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