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ALDP105W - Panasonic

Description: General Purpose Relays LD-P Relay

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PCB Footprints
ALDP105W - Panasonic PCB footprint - Other - Other - ALDP
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ALDP105W - Panasonic  - 3D model - Other - ALDP
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ALDP105W Details

  • Manufacturer Part Number:

    ALDP105W

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7.87

  • Body Breadth:

    7.2 mm

  • Body Height:

    15.3 mm

  • Body Length or Diameter:

    20.5 mm

  • Coil Current(DC)-Max:

    0.04 A

  • Coil Operate Voltage(DC):

    3.75 V

  • Coil Power:

    200 mW

  • Coil Release Voltage(DC):

    0.25 V

  • Coil Resistance:

    125 Ω

  • Coil Voltage(DC)-Max:

    5 V

  • Coil Voltage-Nom:

    5 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Power Rating R Load:

    1385VA@277VAC

  • Contact (AC) Max Rating R Load:

    5A@277VAC

  • Contact Current(AC)-Max:

    5 A

  • Contact Resistance:

    100 mΩ

  • Contact Voltage(AC)-Max:

    277 V

  • Contact/Output Supply Type:

    AC

  • Electrical Life:

    100000 Cycle(s)

  • End Contact Material:

    Silver Nickel

  • Input Switching Control Type:

    Random

  • Insulation Resistance:

    1000000000 Ω

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Terminals:

    4

  • Operate Time:

    10 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BOX

  • Physical Dimension:

    20.5mm x 7.2mm x 15.3mm

  • Reference Standard:

    UL; VDE

  • Relay Action:

    MOMENTARY

  • Relay Form:

    1 FORM A

  • Relay Function:

    SPST

  • Relay Type:

    POWER/SIGNAL RELAY

  • Release Time:

    10 ms

  • Surface Mount:

    NO

  • Terminal Length:

    0.0034010668021336042 inch

  • Termination Type:

    SOLDER

ALDP105W Frequently Asked Questions (FAQs)

  • A good PCB layout for the ALDP105W involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source to minimize inductance. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using a thermally conductive interface material, and keeping the device within its recommended operating temperature range.
  • To minimize EMI emissions, use a shielded enclosure, keep the device away from antennas and other EMI-sensitive components, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the PCB layout is optimized for EMI reduction.
  • Yes, the ALDP105W can be used in a redundant or parallel configuration to achieve higher power output. However, it's essential to ensure that the devices are properly synchronized and that the output voltages are matched to prevent current imbalance and reduce the risk of overheating.
  • Derating considerations for the ALDP105W include ambient temperature, input voltage, and output current. To calculate the maximum output current, refer to the datasheet's derating curves and formulas, and consider factors such as thermal resistance, junction temperature, and output voltage.

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ALDP105W Overview

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