AM1707BZKB3 - Texas Instruments

AM1707BZKB3 Details

• Manufacturer Part Number:

  AM1707BZKB3

• Brand Name:

  Texas Instruments

• Pbfree Code:

  No

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256

• Pin Count:

  256

• HTS Code:

  8542.31.00.25

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Address Bus Width:

  16

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  20 MHz

• External Data Bus Width:

  16

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B256

• JESD-609 Code:

  e1

• Length:

  17 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  256

• Operating Temperature-Max:

  90 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA256,16X16,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.05 mm

• Speed:

  375 MHz

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC