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AM2431BSDGHIALVR - Texas Instruments

Description: ARM Microcontrollers - MCU Arm® Cortex®-R5F-based MCU with industrial communications and security up to 800 MHz 441-FCBGA -40 to 125

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AM2431BSDGHIALVR - Texas Instruments - PCB symbol
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PCB Footprints
AM2431BSDGHIALVR - Texas Instruments PCB footprint - BGA - BGA - ALV0441A
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3D Models
AM2431BSDGHIALVR - Texas Instruments - 3D model - BGA - ALV0441A
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AM2431BSDGHIALVR Details

  • Manufacturer Part Number:

    AM2431BSDGHIALVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Clock Frequency-Max:

    800 MHz

  • JESD-30 Code:

    S-PBGA-B441

  • Length:

    17.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    441

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HFBGA

  • Package Equivalence Code:

    BGA441,21X21,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.652 mm

  • Supply Voltage-Max:

    0.895 V

  • Supply Voltage-Min:

    0.81 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17.2 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM2431BSDGHIALVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane on the bottom layer, and thermal vias under the device to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • The AM2431BSDGHIALVR requires a well-regulated power supply with low noise and ripple. TI recommends using a high-quality LDO or switching regulator with a low output impedance to ensure stable operation. Additionally, decoupling capacitors should be placed close to the device pins to reduce noise and improve power integrity.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, TI recommends operating the device within a narrower range of 0°C to 105°C for optimal performance and reliability.
  • The POR and BOR features are designed to ensure the device powers up correctly and recovers from brown-out conditions. TI recommends using an external reset circuit with a time delay of at least 10 ms to ensure the device has sufficient time to power up and stabilize before the reset signal is released.
  • TI recommends using ESD protection devices such as TVS diodes or ESD arrays on the I/O lines to protect the device from electrostatic discharge. Additionally, handling the device with ESD-safe materials and following proper handling procedures can help prevent damage.

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AM2431BSDGHIALVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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