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AM2432BSDGHIALVR - Texas Instruments

Description: ARM Microcontrollers - MCU Dual-core Arm Corte x-R5F-based MCU wit

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AM2432BSDGHIALVR - Texas Instruments - PCB symbol
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PCB Footprints
AM2432BSDGHIALVR - Texas Instruments PCB footprint - BGA - BGA - ALV0441A
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3D Models
AM2432BSDGHIALVR - Texas Instruments - 3D model - BGA - ALV0441A
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AM2432BSDGHIALVR Details

  • Manufacturer Part Number:

    AM2432BSDGHIALVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Clock Frequency-Max:

    800 MHz

  • JESD-30 Code:

    S-PBGA-B441

  • Length:

    17.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    441

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HFBGA

  • Package Equivalence Code:

    BGA441,21X21,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.652 mm

  • Supply Voltage-Max:

    0.895 V

  • Supply Voltage-Min:

    0.81 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17.2 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM2432BSDGHIALVR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the AM2432BSDGHIALVR thermal design guide (SLUAU93). It suggests using a 4-layer PCB with a solid ground plane, thermal vias, and a heat sink to achieve optimal thermal performance.
  • The AM2432BSDGHIALVR has a low-power mode that can be enabled by setting the POWER_MODE pin to a logic low. Additionally, the device can be configured for low-power mode using the I2C interface by writing to the POWER_MODE register (address 0x01). Refer to the datasheet for more information.
  • The AM2432BSDGHIALVR is rated for operation from -40°C to 125°C (TJ). However, the device's performance and accuracy may degrade at extreme temperatures. It's essential to follow the recommended operating conditions and thermal design guidelines to ensure reliable operation.
  • The AM2432BSDGHIALVR is designed to operate in environments with moderate vibration. However, it's essential to follow proper PCB design and assembly guidelines to ensure the device's reliability in high-vibration environments. Texas Instruments recommends following the JEDEC standards for vibration testing (JESD22-B103).
  • To troubleshoot I2C communication issues, ensure that the I2C bus is properly terminated, and the clock frequency is within the recommended range (100 kHz to 400 kHz). Use a logic analyzer or oscilloscope to verify the I2C signals and check for bus contention or clock stretching issues. Refer to the datasheet and application notes for more troubleshooting tips.

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AM2432BSDGHIALVR Overview

Use the download button to access the AM2432BSDGHIALVR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AM243, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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