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AM29BL802CB-65RZF - AMD

Description: he following document contains information on Spansion memory products. Although the document is marked with the name of the company that originally developed the specification, Spansion will continue to offer these products to existing customers

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AM29BL802CB-65RZF - AMD PCB footprint - Small Outline Packages - Small Outline Packages - SSO056—56-Pin Shrink Small Outline Package
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3D Models
AM29BL802CB-65RZF - AMD  - 3D model - Small Outline Packages - SSO056—56-Pin Shrink Small Outline Package
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AM29BL802CB-65RZF Details

  • Manufacturer Part Number:

    AM29BL802CB-65RZF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    AMD

  • Access Time-Max:

    65 ns

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Data Polling:

    YES

  • JESD-30 Code:

    R-PDSO-G56

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Sectors/Size:

    1,2,1,3,2

  • Number of Terminals:

    56

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP56,.6,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Sector Size:

    8K,4K,48K,64K,128K

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

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