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AM3352ZCED50 - Texas Instruments

Description: Microprocessors - MPU ARM Cortex-A8 Microproc

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AM3352ZCED50 - Texas Instruments - PCB symbol
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PCB Footprints
AM3352ZCED50 - Texas Instruments PCB footprint - BGA - BGA - ZCE (S-PBGA-N298)
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AM3352ZCED50 - Texas Instruments - 3D model - BGA - ZCE (S-PBGA-N298)
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AM3352ZCED50 Details

  • Manufacturer Part Number:

    AM3352ZCED50

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    GREEN, PLASTIC, NFBGA-298

  • Pin Count:

    298

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    28

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    26 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B298

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    298

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA298,19X19,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.3 mm

  • Speed:

    500 MHz

  • Supply Voltage-Max:

    1.144 V

  • Supply Voltage-Min:

    1.056 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

AM3352ZCED50 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AM3352ZCED50 is -40°C to 90°C. However, it's recommended to operate within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The pin multiplexing on the AM3352ZCED50 can be configured using the Control Module (CM_PER) registers. You need to set the correct mode and function for each pin using the CM_PER registers. Refer to the TRM (Technical Reference Manual) for more details.
  • The maximum clock speed for the AM3352ZCED50 is 1 GHz. However, the default clock speed is 800 MHz, and you can adjust it using the clock control registers.
  • The PRU-ICSS is a subsystem that provides real-time processing and industrial communication capabilities. You can use the PRU-ICSS by programming the PRU cores using the TI-provided PRU-ICSS firmware and APIs. Refer to the PRU-ICSS documentation and examples for more details.
  • The power consumption of the AM3352ZCED50 varies depending on the operating frequency, voltage, and usage. The typical power consumption is around 1.5W at 1 GHz, but it can be as low as 100 mW in low-power modes. Refer to the datasheet and power management documentation for more details.

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AM3352ZCED50 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image AM3352ZCE50 Texas Instruments

RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA298