AM3354ZCZ80 - Texas Instruments

AM3354ZCZ80 Details

• Manufacturer Part Number:

  AM3354ZCZ80

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  NFBGA-324

• Pin Count:

  324

• HTS Code:

  8542.31.00.25

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Address Bus Width:

  16

• Bit Size:

  32

• Boundary Scan:

  YES

• External Data Bus Width:

  16

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B324

• JESD-609 Code:

  e1

• Length:

  15 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  324

• Operating Temperature-Max:

  90 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA324,18X18,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Speed:

  800 MHz

• Supply Current-Max:

  800 mA

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  15 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC