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AM6234ATCGGAALW - Texas Instruments

Description: Internet of Things (IoT) and gateway SoC with Arm® Cortex®-A53-based object and gesture recognition

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AM6234ATCGGAALW - Texas Instruments - PCB symbol
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PCB Footprints
AM6234ATCGGAALW - Texas Instruments PCB footprint - BGA - BGA - ALW0425A
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3D Models
AM6234ATCGGAALW - Texas Instruments - 3D model - BGA - ALW0425A
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AM6234ATCGGAALW Details

  • Manufacturer Part Number:

    AM6234ATCGGAALW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B425

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    425

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA425,25X25,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Screening Level:

    ISO 26262

  • Seated Height-Max:

    0.89 mm

  • Speed:

    1400 MHz

  • Supply Voltage-Max:

    0.79 V

  • Supply Voltage-Min:

    0.715 V

  • Supply Voltage-Nom:

    0.75 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM6234ATCGGAALW Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane on the bottom layer, and thermal vias connecting the exposed pad to the ground plane to ensure optimal thermal performance.
  • The exposed pad (EP) should be connected to a solid ground plane on the PCB to ensure good thermal performance and to prevent electrical noise. A thermal pad or a copper pour on the PCB can be used to connect the EP to the ground plane.
  • The maximum operating temperature range for the AM6234ATCGGAALW is -40°C to 125°C. However, the device can be operated up to 150°C for short periods of time, but this may affect its reliability and lifespan.
  • To ensure EMC, use a shielded enclosure, keep the PCB layout compact, use a common-mode choke, and add decoupling capacitors to the power supply lines. Additionally, follow the recommended layout guidelines and use a 4-layer PCB with a solid ground plane.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN). This ensures that the internal voltage regulators are properly initialized and that the device operates correctly.

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AM6234ATCGGAALW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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