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AM6442BSFGHAALV - Texas Instruments

Description: Microprocessors - MPU Dual-core 64-bit Arm Cortex-A53, quad-core Cortex-R5F, PCIe, USB 3.0 and security

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AM6442BSFGHAALV - Texas Instruments PCB footprint - BGA - BGA - 441-BGA-2.652
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AM6442BSFGHAALV - Texas Instruments  - 3D model - BGA - 441-BGA-2.652
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AM6442BSFGHAALV Details

  • Manufacturer Part Number:

    AM6442BSFGHAALV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 0.85V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B441

  • Length:

    17.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    441

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA441,21X21,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.652 mm

  • Speed:

    1000 MHz

  • Supply Voltage-Max:

    0.79 V

  • Supply Voltage-Min:

    0.715 V

  • Supply Voltage-Nom:

    0.75 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17.2 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

AM6442BSFGHAALV Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the core voltage (VDD_CORE) first, followed by the input/output voltage (VDD_IO). This ensures proper device operation and prevents latch-up or damage.
  • To optimize the DDR memory interface, ensure that the memory clock frequency is within the recommended range (up to 1600 MT/s), and adjust the memory timing parameters (e.g., tCL, tRAS, tRCD) according to the specific DDR memory module used. Additionally, implement proper signal integrity and routing guidelines to minimize signal degradation.
  • The maximum operating temperature range for the AM6442BSFGHAALV is -40°C to 100°C (industrial temperature range). However, it's essential to ensure proper thermal management and heat dissipation to prevent overheating and maintain reliable operation.
  • To configure the device for low-power modes, use the Power and Sleep Controller (PSC) module to control the power domains and clock frequencies. The device supports various low-power modes, including idle, standby, and shutdown modes, which can be configured using the PSC registers and clock control modules.
  • Follow the recommended PCB layout guidelines provided in the Texas Instruments documentation, including the 'AM64x Sitara Processors PCB Layout Guidelines' document. Key considerations include signal integrity, power integrity, and thermal management, as well as proper placement and routing of critical signals, such as clock and reset signals.

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AM6442BSFGHAALV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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