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AMC1300BQDWVRQ1 - Texas Instruments

Description: Isolation Amplifiers Automotive +/-250-mV input, reinforced isolated amplifier with high CMTI for current sensing

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AMC1300BQDWVRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV0008A
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AMC1300BQDWVRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DWV0008A
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AMC1300BQDWVRQ1 Details

  • Manufacturer Part Number:

    AMC1300BQDWVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-04-11

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    0.25 V

  • Analog Input Voltage-Min:

    -0.25 V

  • Bandwidth (3dB)-Nom:

    0.31 MHz

  • Common Mode Voltage-Max:

    3.4 V

  • Input Offset Voltage-Max:

    200 µV

  • Isolation Voltage-Min:

    1500 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.03%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max:

    9.8 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    0.31

  • Width:

    5.85 mm

AMC1300BQDWVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1300BQDWVRQ1 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. Additionally, consider using an external calibration voltage source and a precision voltage reference to improve accuracy.
  • The AMC1300BQDWVRQ1 has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and avoid exceeding the maximum power dissipation. Additionally, consider using thermal simulation tools to model the thermal performance of your design.
  • The AMC1300BQDWVRQ1's digital output data can be handled using a microcontroller or FPGA. Consider using a FIFO or buffer to handle the high-speed data output, and implement digital filtering and processing algorithms to extract the desired information from the data. Additionally, consider using a dedicated ADC interface or a digital signal processing core to simplify data processing.
  • To ensure EMI and EMC compliance, follow proper PCB layout and design practices, use shielding and filtering as necessary, and consider using a metal enclosure or shielded cables to reduce emissions. Additionally, perform EMI and EMC testing and certification to ensure compliance with regulatory standards such as FCC, CE, and CISPR.

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AMC1300BQDWVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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