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AMC1311BDWVR - Texas Instruments

Description: Precision Reinforced Isolated Amplifier With High CMTI for Current Sensing

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AMC1311BDWVR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV0008A
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AMC1311BDWVR - Texas Instruments  - 3D model - Small Outline Packages - DWV0008A
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AMC1311BDWVR Details

  • Manufacturer Part Number:

    AMC1311BDWVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-12-02

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Bandwidth (3dB)-Nom:

    275 MHz

  • Common Mode Voltage-Max:

    1.49 V

  • Isolation Voltage-Min:

    1500 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.04%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max:

    9.7 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.85 mm

AMC1311BDWVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1311BDWVR involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. It's also important to ensure the device is operated within its specified temperature range and that the input signals are within the recommended voltage range.
  • When selecting an external clock source for the AMC1311BDWVR, consider the clock frequency, jitter, and phase noise. The clock frequency should be within the recommended range (typically 10-50 MHz), and the jitter and phase noise should be minimized to ensure accurate conversions. Additionally, ensure the clock source is synchronized with the AMC1311BDWVR's internal clock to prevent phase errors.
  • The AMC1311BDWVR provides error flags and interrupt signals to indicate overflow or underflow conditions. Engineers can use these flags to implement error handling mechanisms, such as resetting the device, re-initializing the conversion process, or triggering an alert to the system. It's essential to carefully read and understand the error handling section in the datasheet to ensure proper implementation.
  • The AMC1311BDWVR is sensitive to temperature, and proper thermal management is crucial for reliable operation. Ensure good airflow around the device, use a heat sink if necessary, and avoid exposing the device to extreme temperatures. Additionally, follow the recommended operating temperature range (typically -40°C to 125°C) and consider using thermal protection mechanisms, such as thermal shutdown or thermal warning, to prevent damage or malfunction.

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AMC1311BDWVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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