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AMC3302DWE - Texas Instruments

Description: Isolation Amplifiers +/-50-mV input, precision reinforced isolated amplifier with integrated DC/DC converter 16-SOIC -40 to 125

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AMC3302DWE - Texas Instruments - PCB symbol
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AMC3302DWE - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWE0016A
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AMC3302DWE - Texas Instruments - 3D model - Small Outline Packages - DWE0016A
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AMC3302DWE Details

  • Manufacturer Part Number:

    AMC3302DWE

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-12-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    0.05 V

  • Analog Input Voltage-Min:

    -0.05 V

  • Bandwidth (3dB)-Nom:

    0.34 MHz

  • Common Mode Voltage-Max:

    1 V

  • Input Offset Voltage-Max:

    100 µV

  • Isolation Voltage-Min:

    1200 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Non-linearity-Max:

    0.03%

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    42 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    0.334

  • Width:

    7.5 mm

AMC3302DWE Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC3302DWE involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The AMC3302DWE requires calibration to ensure accurate measurements. This can be done by applying a known input voltage and adjusting the internal calibration registers to achieve the desired accuracy. The calibration process is typically done during the manufacturing process, but it may need to be repeated if the device is exposed to extreme temperatures or other environmental factors.
  • The recommended input voltage range for the AMC3302DWE is 0 to 5.5V. Operating the device outside of this range may affect its accuracy and linearity. It's essential to ensure the input voltage is within the recommended range to achieve optimal performance.
  • The AMC3302DWE has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients. The OVP circuit limits the input voltage to 5.5V, while the UVP circuit ensures the device remains in a low-power state when the input voltage is below 2.5V.
  • The maximum data rate for the AMC3302DWE's SPI interface is 20 MHz. To optimize the interface for high-speed applications, it's recommended to use a high-speed clock source, minimize the number of clock cycles per transaction, and use a low-capacitance PCB layout to reduce signal reflections and noise.

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AMC3302DWE Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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