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AMIS42770ICAW1G - onsemi

Description: Obsolete - Dual CAN Transceiver, High Speed, for long networks

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AMIS42770ICAW1G - onsemi - PCB symbol
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AMIS42770ICAW1G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 20 W CASE 751AQ-01
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AMIS42770ICAW1G - onsemi - 3D model - Small Outline Packages - SOIC 20 W CASE 751AQ-01
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AMIS42770ICAW1G Details

  • Manufacturer Part Number:

    AMIS42770ICAW1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-20 Wide Body

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    751AQ

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.7762 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Transceivers:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6416 mm

  • Supply Current-Max:

    0.1375 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5184 mm

AMIS42770ICAW1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the AMIS42770ICAW1G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions, and consult with onsemi's application engineers for specific requirements.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper power supply, decoupling, and PCB layout. Use oscilloscopes and logic analyzers to debug the device's behavior. If issues persist, contact onsemi's technical support for assistance.

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AMIS42770ICAW1G Overview

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