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AP0102AT2L00XPGA0-DR - onsemi

Description: HDR

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AP0102AT2L00XPGA0-DR Details

  • Manufacturer Part Number:

    AP0102AT2L00XPGA0-DR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFBGA-100

  • Manufacturer Package Code:

    138AH

  • Country Of Origin:

    Malaysia

  • Factory Lead Time:

    30 Weeks

  • Date Of Intro:

    2020-02-04

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PBGA-B100

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Peak Reflow Temperature (Cel):

    260

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

AP0102AT2L00XPGA0-DR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to maintain reliability.
  • Implement ESD protection measures such as using ESD-sensitive handling procedures, using ESD-protective packaging, and incorporating ESD-protection circuits in the design. The device itself has some level of ESD protection, but additional measures may be necessary depending on the application.
  • Follow standard PCB assembly and rework procedures for QFN packages. Ensure that the device is handled by trained personnel, and that the PCB is cleaned and dried before assembly. Use a rework station with a QFN-specific nozzle to prevent damage during rework.

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AP0102AT2L00XPGA0-DR Overview

Use the download button to access the AP0102AT2L00XPGA0-DR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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