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AP0200AT2L00XEGA0-DR - onsemi

Description: HDR; Ethernet

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AP0200AT2L00XEGA0-DR - onsemi  - 3D model
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AP0200AT2L00XEGA0-DR Details

  • Manufacturer Part Number:

    AP0200AT2L00XEGA0-DR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFBGA-100

  • Package Description:

    VFBGA-100

  • Manufacturer Package Code:

    138AH

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    30 Weeks

  • Manufacturer:

    onsemi

  • JESD-30 Code:

    S-PBGA-B100

  • Length:

    7 mm

  • Number of Terminals:

    100

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA100,10X10,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

AP0200AT2L00XEGA0-DR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the device on a 2-layer or 4-layer board with a solid ground plane, and using thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management. Consult the onsemi application note AND9238/D for more details.
  • Refer to the onsemi application note AND9238/D, which provides guidance on biasing and configuring the AP0200AT2L00XEGA0-DR for various applications, including audio amplifiers, line drivers, and power amplifiers.
  • The recommended input termination scheme involves using a series resistor and capacitor to match the input impedance, while the output termination scheme involves using a series resistor and capacitor to match the load impedance. Consult the onsemi application note AND9238/D for specific values and configurations.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins. Also, follow proper handling and storage procedures to prevent damage from moisture, temperature, and mechanical stress.
  • The device is rated for operation up to 150°C. For temperatures above 125°C, derate the power dissipation by 1.5% per degree Celsius to ensure reliable operation. Consult the onsemi datasheet for more information.

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AP0200AT2L00XEGA0-DR Overview

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