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AP2012SF4C-P22 - Kingbright

Description: 2.0X1.2MM INFRARED SMD LED

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PCB Footprints
AP2012SF4C-P22 - Kingbright PCB footprint - LEDs Chip - LEDs Chip - AP2012SGD3
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AP2012SF4C-P22 Details

  • Manufacturer Part Number:

    AP2012SF4C-P22

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    Kingbright

  • YTEOL:

    6.85

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.6 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    INFRARED LED

  • Packing Method:

    TR, 7 INCH

  • Peak Wavelength:

    880 nm

  • Reverse Voltage-Max:

    5 V

  • Semiconductor Material:

    GaAlAs

  • Shape:

    RECTANGULAR

  • Size:

    1.3 mm

  • Spectral Bandwidth:

    50 m

  • Surface Mount:

    YES

  • Viewing Angle:

    160 deg

AP2012SF4C-P22 Frequently Asked Questions (FAQs)

  • The recommended storage temperature for AP2012SF4C-P22 is -20°C to 30°C (-4°F to 86°F) with a relative humidity of 60% or less.
  • While AP2012SF4C-P22 is not specifically designed for outdoor use, it can be used in outdoor applications if properly protected from moisture and extreme temperatures. However, it's essential to follow proper sealing and encapsulation methods to ensure reliability.
  • The maximum forward current for AP2012SF4C-P22 is 30mA. Exceeding this current may reduce the LED's lifespan or cause damage.
  • To prevent electrostatic discharge (ESD) damage, handle AP2012SF4C-P22 with anti-static wrist straps, mats, or other ESD protection devices. Ground yourself before handling the LED, and avoid touching the pins or leads.
  • AP2012SF4C-P22 is rated for operation up to 85°C (185°F). While it can tolerate high temperatures, prolonged exposure above 80°C (176°F) may affect its lifespan. Ensure proper heat dissipation and thermal management in high-temperature applications.

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AP2012SF4C-P22 Overview

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