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AP2101MPG-13 - Diodes Incorporated

Description: DiodesZetex AP2101MPG-13, Dual Power Distribution Switch, Low Side, 115mΩ, 2.7 V min. 8-Pin, MSOP 8EP

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Symbol
AP2101MPG-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP2101MPG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-8EP_2024_1
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3D Models
AP2101MPG-13 - Diodes Incorporated - 3D model - Small Outline Packages - MSOP-8EP_2024_1
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AP2101MPG-13 Details

  • Manufacturer Part Number:

    AP2101MPG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:2.45A; THERMAL SHUTDOWN:140C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -35 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.9V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AP2101MPG-13 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the AP2101MPG-13 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A minimum of 2oz copper thickness is recommended, and thermal vias can be used to improve heat dissipation.
  • To ensure stable output voltage regulation, it is recommended to use a high-quality output capacitor with low ESR (Equivalent Series Resistance) and a minimum capacitance of 10uF. Additionally, the input capacitor should be placed close to the device and have a minimum capacitance of 1uF.
  • The maximum input voltage that can be applied to the AP2101MPG-13 is 18V, although the recommended maximum input voltage is 15V for optimal performance and reliability.
  • Yes, the AP2101MPG-13 can be used in high-temperature applications up to 125°C, but the output current should be derated according to the temperature derating curve provided in the datasheet.
  • The power dissipation of the AP2101MPG-13 can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.

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AP2101MPG-13 Overview

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