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AP2111MPG-13 - Diodes Incorporated

Description: Power Switch/Driver 1:1 P-Channel 2A 8-MSOP-EP

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Symbol
AP2111MPG-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP2111MPG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-8EP-2021
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3D Models
AP2111MPG-13 - Diodes Incorporated - 3D model - Small Outline Packages - MSOP-8EP-2021
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AP2111MPG-13 Details

  • Manufacturer Part Number:

    AP2111MPG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:2.45A; THERMAL SHUTDOWN:140C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -35 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.9V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AP2111MPG-13 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, a minimum ESR (Equivalent Series Resistance) of 1 ohm for the output capacitor is recommended.
  • The AP2111MPG-13 is rated for operation up to 85°C ambient temperature. However, it's recommended to derate the device's power dissipation accordingly to ensure reliable operation.
  • While ceramic capacitors can be used, they may not be the best choice due to their high ESR. A low-ESR electrolytic capacitor or a polymer capacitor is recommended for the output capacitor to ensure stability and low output ripple.
  • The power dissipation of the AP2111MPG-13 can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet's efficiency vs. output current graph.

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AP2111MPG-13 Overview

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