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AP2111SG-13 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution 2A/5.5V SNGL CHANL CURRENT-LIMIT USB SW

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AP2111SG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - AP2111SG-13
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AP2111SG-13 - Diodes Incorporated  - 3D model - Small Outline Packages - AP2111SG-13
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AP2111SG-13 Details

  • Manufacturer Part Number:

    AP2111SG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:2.45A; THERMAL SHUTDOWN:140C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -35 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.9V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AP2111SG-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to use a sufficient output capacitor with a low ESR value, and consider adding a small ceramic capacitor in parallel with the output capacitor to filter out high-frequency noise.
  • Although the datasheet specifies a maximum input voltage of 15V, it's recommended to limit the input voltage to 12V to ensure reliable operation and prevent overheating.
  • While the AP2111SG-13 is rated for operation up to 125°C, it's essential to consider the thermal derating curve and ensure that the device does not exceed the maximum junction temperature. In high-temperature environments, consider using a heat sink or a thermal interface material to improve heat dissipation.
  • To calculate the output voltage ripple and noise, consider the output capacitor value, ESR, and ESL. A good starting point is to use the equations provided in the datasheet or to use a simulation tool like SPICE to model the circuit and estimate the output voltage ripple and noise.

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