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AP2152AMPG-13 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution DUAL SWITCH 125mOhms 0.5A

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AP2152AMPG-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP2152AMPG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - AL5814QMP-13
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3D Models
AP2152AMPG-13 - Diodes Incorporated - 3D model - Small Outline Packages - AL5814QMP-13
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AP2152AMPG-13 Details

  • Manufacturer Part Number:

    AP2152AMPG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    GREEN, MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AP2152AMPG-13 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure stability and prevent oscillations in the output voltage, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor has a low ESR and is placed close to the output pin.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device.
  • While the AP2152AMPG-13 is rated for operation up to 125°C, it's essential to consider the thermal derating curves and ensure that the device does not exceed the maximum junction temperature (Tj) of 150°C.
  • To calculate the output voltage ripple and noise, you can use the following formula: ΔVout = (Iout * ESR) / (f * Cout), where Iout is the output current, ESR is the equivalent series resistance of the output capacitor, f is the switching frequency, and Cout is the output capacitance.

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AP2152AMPG-13 Overview

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