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AP2171DMPG-13 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution 1A SINGLE CH USB 2.0 Switch 2.7V-5.5V

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AP2171DMPG-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP2171DMPG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-8EPsss
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3D Models
AP2171DMPG-13 - Diodes Incorporated - 3D model - Small Outline Packages - MSOP-8EPsss
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AP2171DMPG-13 Details

  • Manufacturer Part Number:

    AP2171DMPG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    GREEN, MSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

AP2171DMPG-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, a minimum of 10uF capacitance is recommended at the input and output.
  • The maximum ambient temperature for reliable operation is 85°C. However, it's recommended to derate the device's power dissipation to ensure reliable operation over the entire temperature range.
  • While the datasheet recommends a specific inductor value and type, you can use a different value or type as long as it meets the required inductance and current rating. However, this may affect the device's performance and efficiency.
  • To troubleshoot issues, start by checking the PCB layout and component values against the recommended values. Then, use an oscilloscope to check the input and output waveforms, and verify that the device is operating within the recommended specifications.

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AP2171DMPG-13 Overview

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