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AP2176SG-13 - Diodes Incorporated

Description: DiodesZetex AP2176SG-13, Dual Power Distribution Switch, High Side, 135mΩ, 2.7 V min., 8-Pin SOIC

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AP2176SG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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AP2176SG-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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AP2176SG-13 Details

  • Manufacturer Part Number:

    AP2176SG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Built-in Protections:

    OVER CURRENT; THERMAL

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    1 A

  • Output Peak Current Limit-Nom:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AP2176SG-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's essential to use a suitable output capacitor with a low ESR (Equivalent Series Resistance) and a sufficient capacitance value. A minimum capacitance value of 10uF is recommended.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device.
  • While the AP2176SG-13 is rated for operation up to 125°C, it's essential to consider the thermal derating curve and ensure that the device does not exceed the maximum junction temperature (Tj) of 150°C.
  • To calculate the power dissipation, use the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.

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