SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.7 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
AP2181DMPG-13 Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure stable output voltage with varying input voltage, it's essential to use a suitable input capacitor with low ESR, and to decouple the output with a capacitor of at least 10uF. Additionally, the output voltage can be adjusted using the feedback resistors to maintain a stable output voltage.
The maximum ambient temperature for reliable operation of the AP2181DMPG-13 is 85°C. However, the device can operate up to 125°C with derating. It's essential to ensure proper thermal management to prevent overheating.
Yes, the AP2181DMPG-13 is suitable for high-reliability applications. It's manufactured using a robust process, and Diodes Incorporated provides a high level of quality control. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.
The AP2181DMPG-13 has built-in overcurrent protection (OCP) and short-circuit protection (SCP). However, it's still recommended to add external protection components, such as fuses or PTC resistors, to prevent damage from excessive current or voltage.
Trust Checks
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Manufacturer Collaborated
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System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
AP2181DMPG-13 Overview
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