SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.1 mm
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.7 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
3 mm
AP2411AMP-13 Frequently Asked Questions (FAQs)
For optimal thermal performance, it is recommended to have a solid ground plane on the bottom layer of the PCB, and to use thermal vias to connect the exposed pad of the AP2411AMP-13 to the ground plane. Additionally, keeping the PCB traces and components away from the device can help to reduce thermal resistance.
To ensure stable operation with a high-ESR output capacitor, it is recommended to add a small ceramic capacitor (e.g. 100nF) in parallel with the output capacitor to provide a low-ESR path for high-frequency noise. Additionally, the output capacitor should be placed close to the AP2411AMP-13 to minimize the loop inductance.
The maximum junction temperature that the AP2411AMP-13 can withstand is 150°C. However, it is recommended to keep the junction temperature below 125°C for reliable operation and to prevent thermal runaway.
The AP2411AMP-13 is rated for a maximum input voltage of 18V. While it can tolerate some voltage transients, it is not recommended to use the device in a high-voltage application (e.g. > 20V) without proper protection, such as a voltage clamp or a TVS diode.
The power dissipation of the AP2411AMP-13 can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current. The resulting power dissipation should be within the recommended operating range to prevent overheating.
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AP2411AMP-13 Overview
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