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AP2553FDC-7 - Diodes Incorporated

Description: DiodesZetex AP2553FDC-7, USB Power Switch, High Side, 150mΩ, 2.7 V min., 6-Pin U-DFN2020

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PCB Footprints
AP2553FDC-7 - Diodes Incorporated PCB footprint - Small Outline No-lead - Small Outline No-lead - U-DFN2020-6
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3D Models
AP2553FDC-7 - Diodes Incorporated  - 3D model - Small Outline No-lead - U-DFN2020-6
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AP2553FDC-7 Details

  • Manufacturer Part Number:

    AP2553FDC-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    DFN-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    32 Weeks, 2 Days

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    3

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.63 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

AP2553FDC-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the output pin of the AP2553FDC-7. Additionally, using a low ESR capacitor can help to reduce output voltage ripple.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device.
  • The power dissipation of the AP2553FDC-7 can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
  • A ceramic capacitor with a value of 1uF to 10uF is recommended for the input capacitor. The capacitor should be placed close to the input pin of the AP2553FDC-7 to reduce noise and ripple.

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