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AP5725FDCG-7 - Diodes Incorporated

Description: LED Lighting Drivers WH LED STEP-UP DC/DC CONV 2-6 LED

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PCB Footprints
AP5725FDCG-7 - Diodes Incorporated PCB footprint - Small Outline No-lead - Small Outline No-lead - U-DFN2020C-6
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3D Models
AP5725FDCG-7 - Diodes Incorporated  - 3D model - Small Outline No-lead - U-DFN2020C-6
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AP5725FDCG-7 Details

  • Manufacturer Part Number:

    AP5725FDCG-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    2 X 2 MM, GREEN, DFN-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.75 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.63 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    1400 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

AP5725FDCG-7 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor as close to the output pin as possible. Additionally, the output voltage should be decoupled from the input voltage using a capacitor.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it is recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device.
  • The device has built-in overcurrent protection (OCP) and thermal shutdown (TSD) features. However, it is still recommended to add external protection components such as fuses or PTC resistors to prevent damage from excessive current or temperature.
  • The recommended input capacitor value is 1uF to 10uF, and the type should be a low-ESR ceramic capacitor such as X5R or X7R. The input capacitor should be placed as close to the input pin as possible.

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AP5725FDCG-7 Overview

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