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AP63300WU-7 - Diodes Incorporated

Description: DCDC CONV HV BUCK TSOT26

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Symbol
AP63300WU-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP63300WU-7 - Diodes Incorporated PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT26
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3D Models
AP63300WU-7 - Diodes Incorporated - 3D model - SOT23 (6-Pin) - TSOT26
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AP63300WU-7 Details

  • Manufacturer Part Number:

    AP63300WU-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-26, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • Additional Feature:

    ALSO HAS PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    32 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    31 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    550 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

AP63300WU-7 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper power-on and power-off, it is recommended to follow a soft-start sequence, where the input voltage is ramped up slowly to prevent inrush currents. Additionally, a power-good signal can be used to monitor the output voltage and ensure it is within the specified range.
  • When handling the device, it is recommended to take precautions to prevent electrostatic discharge (ESD) damage. This includes using an ESD wrist strap or mat, and handling the device by the body rather than the pins.
  • To troubleshoot issues with the device, it is recommended to first check the input voltage and current, as well as the output voltage and current. Additionally, checking the device's thermal performance and ensuring proper PCB layout can help identify potential issues.
  • Thermal design considerations for this device include ensuring good airflow around the device, using a heat sink if necessary, and optimizing the PCB layout for thermal performance. The device's thermal resistance and junction temperature should also be considered.

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AP63300WU-7 Overview

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