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AP64100SP-13 - Diodes Incorporated

Description: Switching Voltage Regulators DCDC Conv HV Buck SO-8EP(STD) T&R 4K

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AP64100SP-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8EP (Standard)
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3D Models
AP64100SP-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8EP (Standard)
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AP64100SP-13 Details

  • Manufacturer Part Number:

    AP64100SP-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • Additional Feature:

    PULSE FREQUENCY MODULATION TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.63 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.85 mm

AP64100SP-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently. Additionally, it's recommended to have a minimum of 2oz copper thickness and a thermal via array under the IC to improve heat dissipation.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Additionally, it's essential to decouple the input and output pins with suitable capacitors to minimize noise and ensure stable operation.
  • When designing a power supply using the AP64100SP-13, critical components to consider include the input and output capacitors, inductors, and resistors. These components should be selected based on the specific application requirements, such as voltage, current, and frequency.
  • To troubleshoot common issues with the AP64100SP-13, start by checking the PCB layout and thermal design to ensure proper heat dissipation. Verify that the input and output voltages are within the recommended specifications, and check for any signs of oscillation or instability. If issues persist, consult the datasheet and application notes for guidance.
  • Yes, when using the AP64100SP-13, it's essential to consider EMI/EMC guidelines to ensure compliance with regulatory standards. This includes using proper shielding, filtering, and grounding techniques to minimize electromagnetic interference and ensure reliable operation.

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AP64100SP-13 Overview

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